Bergquist

Gap Pad® VO Ultra Soft

Ultra-conformable, thermally-conductive material for filling air gaps

Image of Bergquist's Gap Pad® VO Ultra Soft Bergquist's Gap Pad VO is a cost-effective thermally-conductive interface. The material is a filled thermally-conductive polymer supplied on a rubber coated fiberglass carrier allowing for easy material handling. The conformable nature of Gap Pad VO allows the pad to fill in air gaps between PC boards and heat sinks or a metal chassis.

Subtracting the initial gap pad thickness by the deflection value will give a resultant thickness. The resultant thickness of the Gap Pad will determine the thermal resistance.

Features
  • Thermal conductivity: 1.0 W/m-K
  • Highly-conformable, low-hardness
  • "Gel-like" modulus
  • Designed for low-stress applications
  • Puncture, shear, and tear resistant
Applications
  • Between heat-generating semiconductors or magnetic components and a heat sink
  • Telecommunications
  • Computer and peripherals
  • Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader
  • Power conversion

Gap Pad VO

ImageManufacturer Part NumberDescriptionTypeShapeOutlineAvailable QuantityView Details
THERM PAD 406.4X203.2MM W/ADHGPVO-0.080-AC-0816THERM PAD 406.4X203.2MM W/ADHGap Filler Pad, SheetRectangular406.40mm x 203.20mm0 - ImmediateView Details
THERM PAD 406.4X203.2MM W/ADH2178511THERM PAD 406.4X203.2MM W/ADHGap Filler Pad, SheetRectangular406.40mm x 203.20mm0 - ImmediateView Details
Published: 2013-10-07

Related Product Training Modules

Thermal Interface materials (TIM) Gap Pad Key Product Characteristics Thermal interface materials (TIM) Gap Pad characteristics including thermal, electrical, and mechanical.
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